XCZU5EV-2SFVC784I AMD / Xilinx IC FPGA 252 I/O 784FCBGA

label:
2025/09/30 13
XCZU5EV-2SFVC784I AMD / Xilinx IC FPGA 252 I/O 784FCBGA


CATALOG
XCZU5EV-2SFVC784I COUNTRY OF ORIGIN
XCZU5EV-2SFVC784I PARAMETRIC INFO
XCZU5EV-2SFVC784I PACKAGE INFO
XCZU5EV-2SFVC784I MANUFACTURING INFO
XCZU5EV-2SFVC784I PACKAGING INFO
XCZU5EV-2SFVC784I ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Device Logic Cells 256200
Device Logic Units 256200
Maximum Number of User I/Os 156
Number of I/O Banks 3
Device Number of DLLs/PLLs 8
Number of Multipliers 1248 (27x18)
Tradename Zynq®
Number of Registers 234240
Maximum I/O Performance 16.3Gbps
RAM Bits (Kbit) 5222.4
Total Number of Block RAM 144
Program Memory Type SRAM
Maximum Distributed RAM Bits 3670016
Family Name Zynq® UltraScale+
Process Technology 16nm
Speed Grade 2
Transceiver Blocks 16
Dedicated DSP 1248
Ethernet MACs 4
JTAG Support (-) Yes
PCI Blocks 2
Copy Protection Yes
Shift Registers Utilize Memory
Programmability Yes
In-System Programmability No
Number of Look-up Table Input 6
Reprogrammability Support No
Maximum Operating Supply Voltage (V) 0.892
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Opr
Supplier Temperature Grade Industrial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 0.808
Typical Operating Supply Voltage (V) 0.85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package FC-FBGA
Basic Package Type Ball Grid Array
Pin Count 784
Lead Shape Ball
PCB 784
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 23
Package Width (mm) 23
Package Height (mm) 2.72
Package Diameter (mm) N/R
Seated Plane Height (mm) 3.12
Mounting Surface Mount
Package Material Plastic
Package Description Flip Chip Fine Pitch Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 4
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/R
Terminal Base Material N/R
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ