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| CATALOG |
XM7D-0512 LIFECYCLE
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XM7D-0512 PARAMETRIC INFO
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XM7D-0512 PACKAGE INFO
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XM7D-0512 MANUFACTURING INFO
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XM7D-0512 ECAD MODELS
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LIFECYCLE
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Obsolete
Mar 31,2022
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PARAMETRIC INFO
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| Type |
Mini USB 2.0 Type B |
| Gender |
RCP |
| Number of Contacts |
5 |
| Termination Method |
Solder |
| Number of Ports |
1 |
| Maximum Current Rating (A) |
1 |
| Maximum Voltage Rating |
30VAC |
| Housing Color |
Black |
| Housing Material |
Polybutylene Terephthalate |
| Shell Material |
Copper Alloy |
| Shell Plating |
Tin |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold |
| Insulation Resistance (MOhm) |
100 |
| Maximum Contact Resistance (mOhm) |
50 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
50 |
| Mating Cycle (Cycles) |
5000 |
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PACKAGE INFO
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| Terminal Pitch (mm) |
0.8 |
| Body Orientation |
Right Angle |
| Mounting |
Through Hole |
| Number of Terminals |
5 |
| Product Length (mm) |
7.7 |
| Product Depth (mm) |
9.85 |
| Product Height (mm) |
3.9 |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
250 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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ECAD MODELS
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