YAT-3A+ Mini-Circuits RF ATTENUATOR 3DB 50OHM 6TDFN

label:
2025/12/18 5
YAT-3A+ Mini-Circuits RF ATTENUATOR 3DB 50OHM 6TDFN


CATALOG
YAT-3A+ COUNTRY OF ORIGIN
YAT-3A+ PARAMETRIC INFO
YAT-3A+ PACKAGE INFO
YAT-3A+ MANUFACTURING INFO
YAT-3A+ PACKAGING INFO
YAT-3A+ APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Module/IC Classification IC
Manufacture Type Fixed Attenuator
Maximum Attenuation (dB) 3.8
Minimum Frequency (GHz) 0
Maximum Frequency (GHz) 18
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Typical Attenuation (dB) 3
Maximum VSWR 1.9
Maximum Power Rating (W) 2
Impedance (Ohm) 50
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package MCLP EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 2
Package Width (mm) 2
Package Height (mm) 0.67
Package Diameter (mm) N/R
Package Overall Length (mm) 2
Package Overall Width (mm) 2
Package Overall Height (mm) 0.85(Max)
Seated Plane Height (mm) 0.72
Mounting Surface Mount
Terminal Width (mm) 0.25
Package Weight (g) 0.006
Package Material Plastic
Package Description N/A
Package Family Name N/A
Jedec N/A
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 0.8
Minimum PACKAGE_DIMENSION_H 0.55
Maximum PACKAGE_DIMENSION_L 2.13
Minimum PACKAGE_DIMENSION_L 1.87
Maximum PACKAGE_DIMENSION_W 2.13
Minimum PACKAGE_DIMENSION_W 1.87
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 0.85
Minimum Seated_Plane_Height N/A
Ball Array Length (mm) N/R
Ball Array Width (mm) N/R
Stand-off Height (mm) 0.05(Max)
Number of Column Balls N/R
Number of Row Balls N/R
Terminal Length (mm) 0.35
Terminal Thickness (mm) 0.2
Bottom Pad Length (mm) 1.2
Bottom Pad Width (mm) 0.6
Bottom Pad Chamfer 0.3


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2000|3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


APPLICATIONS
• Cellular
• PCS
• Communications
• Radar
• Defense

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