Z86E0208PSG1925 ZiLOG IC MCU 8BIT 512B OTP 18DIP

label:
2025/08/19 11
Z86E0208PSG1925 ZiLOG IC MCU 8BIT 512B OTP 18DIP


CATALOG
Z86E0208PSG1925 LIFECYCLE
Z86E0208PSG1925 PARAMETRIC INFO
Z86E0208PSG1925 PACKAGE INFO
Z86E0208PSG1925 MANUFACTURING INFO


LIFECYCLE
Obsolete
May 23,2025


PARAMETRIC INFO
Family Name Z8
Data Bus Width (bit) 8
Device Core Z8
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 8
Program Memory Type EPROM
Program Memory Size 512B
RAM Size 125B
Maximum Expanded Memory Size 16MB
Maximum CPU Frequency (MHz) 8
GPIO 14
Number of Timers 1
Core Architecture Z8
Watchdog 1
Analog Comparators 2
Programmability Yes
SPI 0
I2C 0
I2S 0
UART 0
USART 0
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1650
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Temperature Flag Opr
Operating Supply Voltage (V) 5


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 18
Lead Shape Through Hole
PCB 18
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 23.37(Max)
Package Width (mm) 6.48(Max)
Package Height (mm) 3.43(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.24(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material N/A


Продукт RFQ