|
|
• BVCEO > -140V
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• IC = -4A High Continuous Collector Current
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• ICM = -10A Peak Pulse Current
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• Low Saturation Voltage VCE(sat) < -120mV @ IC = -1A
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• RSAT = 92mΩ for a Low Equivalent On-Resistance
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• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
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|
| CATALOG |
ZX5T955GTA COUNTRY OF ORIGIN
|
ZX5T955GTA PARAMETRIC INFO
|
ZX5T955GTA PACKAGE INFO
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ZX5T955GTA MANUFACTURING INFO
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ZX5T955GTA PACKAGING INFO
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ZX5T955GTA APPLICATION
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|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
PNP |
| Configuration |
Single Dual Collector |
| Maximum Collector-Emitter Voltage (V) |
140 |
| Maximum Collector-Base Voltage (V) |
180 |
| Maximum Base-Emitter Voltage (V) |
7 |
| Maximum DC Collector Current (A) |
4 |
| Maximum Power Dissipation (mW) |
3000 |
| Maximum Collector-Emitter Saturation Voltage (V) |
0.06@5mA@0.1A|0.08@50mA@0.5A|0.12@100mA@1A|0.36@300mA@3A |
| Maximum Base-Emitter Saturation Voltage (V) |
1.04@300mA@3A |
| Category |
Bipolar Power |
| Minimum DC Current Gain |
100@10mA@5V|100@1A@5V|45@3A@5V |
| Number of Elements per Chip |
1 |
| Maximum Transition Frequency (MHz) |
120(Typ) |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-223 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.3 |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
3.5 |
| Package Height (mm) |
1.6 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.5 |
| Package Overall Width (mm) |
7 |
| Package Overall Height (mm) |
1.65 |
| Seated Plane Height (mm) |
1.65 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-261AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TA |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Tab At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
APPLICATION
|
• Motor Driving
|
• Line Switching
|
| • Line Switching |
| • Subscriber Line Interface Cards (SLIC) |
| |
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