ZXMP4A16GTA Diodes Incorporated MOSFET P-CH 40V 6.4A SOT223

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2024/10/22 166
ZXMP4A16GTA Diodes Incorporated MOSFET P-CH 40V 6.4A SOT223


• Low Input Capacitance
• Low On-Resistance
• Fast Switching Speed
• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable,and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/


CATALOG
ZXMP4A16GTA PARAMETRIC INFO
ZXMP4A16GTA PACKAGE INFO
ZXMP4A16GTA MANUFACTURING INFO
ZXMP4A16GTA PACKAGING INFO
ZXMP4A16GTA APPLICATIONS


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single Dual Drain
Maximum Drain Source Voltage (V) 40
Maximum Continuous Drain Current (A) 4.6
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 60@10V
Typical Gate Charge @ Vgs (nC) 13.6@5V|26.1@10V
Typical Gate Charge @ 10V (nC) 26.1
Maximum Power Dissipation (mW) 3900
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 1007@20V
Typical Turn-On Delay Time (ns) 2.33
Typical Turn-Off Delay Time (ns) 29.18
Typical Fall Time (ns) 12.54
Typical Rise Time (ns) 8.84
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-223
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Gull-wing
PCB 3
Tab Tab
Pin Pitch (mm) 2.3
Package Length (mm) 6.5
Package Width (mm) 3.5
Package Height (mm) 1.6
Package Diameter (mm) N/R
Package Overall Length (mm) 6.5
Package Overall Width (mm) 7
Package Overall Height (mm) 1.65
Seated Plane Height (mm) 1.65
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-261AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TA
Packaging Tape and Reel
Quantity Of Packaging 1000
Reel Diameter (in) 7
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Tab At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


APPLICATIONS
• DC-DC converters
• Power management functions
• Backlighting

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