Infineon and NVIDIA Redefine Power Delivery for Next-Gen AI Data Centers with 800V HVDC Architecture

Infineon Technologies AG is revolutionizing power delivery architectures for the data centers of the future, particularly those built for artificial intelligence (AI) workloads. In collaboration with NVIDIA, Infineon is developing a next-generation power system based on a new centralized architecture that employs 800V high-voltage direct current (HVDC) distribution. This novel approach significantly improves energy efficiency across the entire data center and enables direct power conversion at the GPU level on the server motherboard.

With deep expertise in power conversion from grid to core, Infineon is accelerating the adoption of HVDC infrastructure using all relevant semiconductor technologies, including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). This marks a significant step forward in enabling more reliable and efficient power delivery in data centers optimized for AI workloads.

The growing number of GPUs—exceeding 100,000 in modern AI data centers—has intensified the demand for more efficient power systems. Looking ahead, AI data centers are expected to require over 1 megawatt (MW) of power per IT rack. To meet these extreme demands, Infineon’s HVDC architecture, combined with high-density multiphase solutions, is setting a new benchmark for performance and component quality in power distribution.

Adam White, President of Infineon’s Power & Sensor Systems Division, commented:
"Infineon is at the forefront of innovation in AI infrastructure. Our deep system-level expertise, paired with NVIDIA’s leadership in accelerated computing, allows us to create power delivery standards that enable faster, more scalable, and more energy-efficient AI data centers."

Gabriele Gorla, Vice President of System Engineering at NVIDIA, added:
"Our new 800V HVDC distribution architecture enhances both energy efficiency and reliability at the data center level. This cutting-edge approach not only supports our sustainability goals but also meets the performance and scalability needs of next-generation AI workloads."

Currently, power distribution in AI data centers is decentralized, with numerous power supply units (PSUs) feeding each AI chip. The emerging architecture will centralize power delivery, optimizing space utilization within server racks and reducing conversion stages. This shift makes high-voltage, high-efficiency power semiconductors more critical than ever.

As a global leader in power semiconductors and system integration, Infineon expects HVDC-based architectures to match or surpass the semiconductor content found in today’s AC-based systems. The company is committed to supporting hyperscale and AI data center operators with advanced DC/DC multiphase solutions and intermediate architectures, offering a broad product portfolio across all relevant semiconductor technologies for end-to-end power delivery.