Infineon Expands SiC Portfolio with New CoolSiC™ JFET Series for Next-Gen Solid-State Power Distribution

To drive innovation in next-generation solid-state power distribution systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has introduced a new family of CoolSiC™ JFETs, extending its wide-bandgap silicon carbide (SiC) offering. Designed for high-efficiency, high-reliability power switching, these devices combine ultra-low conduction losses, robust turn-off capabilities, and outstanding thermal stability—making them an ideal fit for advanced solid-state protection and distribution applications.

With superior short-circuit protection, thermal resilience in linear mode, and precise overvoltage control, CoolSiC JFETs ensure reliable and efficient performance in a wide range of industrial and automotive environments. Target applications include solid-state circuit breakers (SSCBs), AI data center hot-plug systems, e-fuses, motor soft starters, industrial safety relays, and automotive battery disconnect switches.

Dr. Peter Wawer, President of Infineon’s Green Industrial Power Division, commented:
"With CoolSiC JFETs, we're responding to growing demands for smarter, faster, and more robust power distribution systems. This application-driven technology equips our customers with the tools they need to tackle complex challenges in this rapidly evolving field. These devices set a new benchmark in SiC performance with industry-leading RDS(on), reaffirming Infineon’s leadership in wide-bandgap semiconductor technologies."

Outstanding Efficiency and Ruggedness
The first-generation CoolSiC JFETs boast exceptionally low on-resistance (RDS(on)), starting at just 1.5 mΩ for 750 V and 2.3 mΩ for 1200 V variants—significantly reducing conduction losses. Their body-channel optimized design offers superior robustness under short-circuit and avalanche conditions, ensuring durability in critical power systems.

Packaged in Infineon’s top-side cooled Q-DPAK, these devices simplify paralleling and support scalable current handling, enabling compact, high-power systems with flexible layout and integration options. With predictable switching behavior under thermal stress, overload, or fault conditions, the devices deliver exceptional long-term reliability in continuous operation.

Built for Harsh Operating Environments
To address the challenges posed by extreme thermal and mechanical conditions, CoolSiC JFETs leverage Infineon’s .XT interconnect technology and diffusion soldering process. These innovations significantly improve transient thermal impedance and thermal stability under the pulsed and repetitive loads common in industrial systems.

Certified under real-world operating conditions for solid-state switching, and based on a standard Q-DPAK footprint, these devices ensure fast, seamless design integration into both industrial and automotive systems.