Soitec will supply 300mm RF-SOI wafers for GF's 9SW platform
Dec 05,2024
French semiconductor manufacturer Soitec will provide its RF-SOI wafers for GF's latest wireless platform.
Soitec stated that it will provide 300mm RF-SOI wafers for GF's wireless solution 9SW, which will be used to manufacture future 5G and Wi Fi chips.
Soitec stated in a statement, "The transition from 5G to 5G Advanced and ultimately to 6G requires higher performance and energy efficiency, as well as the compactness of next-generation devices
Soitec's clients include TSMC UMC、 Sony and STMicroelectronics are facing significant inventory adjustments in the sluggish smartphone market.
Soitec stated in its first half financial report that the smartphone market has rebounded, driving up sales of RF-SOI wafers, and order volume has rebounded from the low level in the first quarter of this year.
Soitec stated that it will provide 300mm RF-SOI wafers for GF's wireless solution 9SW, which will be used to manufacture future 5G and Wi Fi chips.
Soitec stated in a statement, "The transition from 5G to 5G Advanced and ultimately to 6G requires higher performance and energy efficiency, as well as the compactness of next-generation devices
Soitec's clients include TSMC UMC、 Sony and STMicroelectronics are facing significant inventory adjustments in the sluggish smartphone market.
Soitec stated in its first half financial report that the smartphone market has rebounded, driving up sales of RF-SOI wafers, and order volume has rebounded from the low level in the first quarter of this year.