Texas Instruments Expands Power Management Solutions to Enable the Next Wave of AI Computing

Texas Instruments (TI) today announced new power management ICs and design resources to help enterprises meet the rapidly growing power demands of artificial intelligence (AI) computing. These innovations extend power delivery architectures from 12V and 48V systems up to 800 VDC, addressing the scalability, efficiency, and reliability challenges of next-generation data centers. TI will showcase these solutions at the Open Compute Project (OCP) Global Summit, held October 13–16 in San Jose, California.

New Resources and Solutions

White Paper: “Power Delivery Trade-offs for the Next Wave of AI Compute Growth”
TI, in collaboration with NVIDIA, is developing advanced power management devices to support 800 VDC architectures, as IT rack power is expected to exceed 1 MW within the next two to three years. The white paper revisits power delivery architectures within IT racks and explores system-level challenges and opportunities in achieving high-efficiency, high-power-density energy conversion.

Reference Design: 30-kW AI Server Power Supply
To support demanding AI workloads, TI’s two-stage reference design combines a three-phase, three-level flying capacitor power factor correction (PFC) converter with a dual Delta-Delta three-phase LLC converter. The design can be configured for a single 800V output or as independent power outputs, enabling flexibility and performance at high power levels.

Dual-Phase Smart Power Stage (CSD965203B)
The CSD965203B is one of the industry’s highest power density power stages, delivering up to 100A per phase in a compact 5mm × 5mm QFN package. By integrating two power phases, it allows designers to increase phase count and total power transfer in a smaller PCB footprint, improving both efficiency and thermal performance.

Dual-Phase Smart Power Module for Horizontal Power Delivery (CSDM65295)
The CSDM65295 module provides up to 180A peak output current in a compact 9mm × 10mm × 5mm form factor. It integrates two power stages and two inductors while offering Transient Load Voltage Regulation (TLVR) capabilities. The result is improved power density and thermal management without compromising efficiency or reliability—ideal for data center environments.

GaN Intermediate Bus Converter (LMM104RM0)
TI’s LMM104RM0 converter module delivers up to 1.6 kW of output power within a quarter-brick (58.4 mm × 36.8 mm) footprint. It achieves over 97.5% conversion efficiency and excellent light-load performance, enabling active current sharing across multiple modules for scalable, high-efficiency power distribution.

Why It Matters

Modern AI data centers demand a diverse mix of semiconductor-based architectures to achieve optimal power management, sensing, and data conversion efficiency. With its new design resources and expansive power management portfolio, TI is partnering with data center designers to implement end-to-end power strategies—from grid generation to GPU logic gates—ensuring efficient, safe, and scalable power delivery for the AI era.

“As artificial intelligence evolves, data centers are transforming from simple server facilities into highly complex power infrastructure hubs,” said Chris Suchoski, General Manager of TI’s Data Center Business Unit. “Scalable power infrastructure and higher power efficiency are essential to meeting these demands and driving future innovation. With TI’s devices, designers can create next-generation systems that enable a seamless transition to 800 VDC architectures.”