TI Unveils DLP991UUV: Redefining Maskless Digital Lithography

What’s New

Texas Instruments (TI) has introduced the DLP991UUV Digital Micromirror Device (DMD), a breakthrough that advances next-generation digital lithography. The DLP991UUV is TI’s highest-resolution direct imaging solution to date, featuring 8.9 million pixels, submicron resolution, and a data throughput of 11 billion pixels per second. It enables maskless lithography with exceptional scalability, cost efficiency, and precision — key requirements for increasingly complex semiconductor packaging.

Why It Matters

Maskless digital lithography, which projects circuit patterns directly onto materials without physical masks or templates, is becoming essential in advanced packaging. This technology integrates multiple chips and functions into a single package, enabling smaller, faster, and more energy-efficient systems for high-performance applications such as data centers and 5G.

With TI DLP technology, equipment manufacturers can now achieve high-resolution, large-scale patterning needed for advanced packaging through maskless digital lithography. The new DLP991UUV acts as a programmable optical mask, offering precise pixel-level control and reliable high-speed operation.

Jeff Marsh, Vice President and General Manager of TI’s DLP Products, stated:
“Just as TI’s DLP technology revolutionized the film industry by driving the shift from analog to digital projection, we are once again leading a major transformation. With maskless digital lithography, engineers can push the boundaries of advanced packaging and accelerate the delivery of next-generation computing solutions.”