Taiwan media: TSMC's CoWoS production capacity will reach 240000 pieces in 2024, and Nvidia will achieve a maximum of 150000 pieces According to the DigiTimes of Taiwan media, a few months ago, the rapid demand for Nvidia AI GPU led to a serious shortage of advanced packaging capac...

Industry insiders: promising demand for network chips and ASIC customized chips According to the DigiTimes, the back-end manufacturer sources said that thanks to the progress of 5G, AIoT Internet of Things and Wi Fi technology, th...

Japan plans to mass produce 2nm chips, focusing on 2.5D and 3D packaging heterogeneous technologies Japan has set a goal to mass produce chips with a 2nm process in the future. According to the DigiTimes, Japan is not only trying to improve the trans...

SK Hynix: Sales of HBM and DDR5 chips for AI will double next year According to businesskorea, SK Hynix is the developer of the world's first 12 layer HBM3 product. Its goal is to double the sales of HBM (high bandwid...

Institution: Sony Leads Far in the CMOS Image Sensor Market in 2022 Yole Intelligence stated yesterday that the total market value of CMOS image sensors in 2022 has slightly decreased compared to 2021, at approximately...

Samsung/LG Display is developing OLED panels with low refractive index CPL Samsung Display and LG Display are the world's largest manufacturers of OLED panels for smartphones, tablets, laptops, and televisions. Their OLED pan...

MediaTek: Currently unable to supply mobile SoC chips to Huawei and will not compete head-on At the French speaking meeting held on July 28, Rick Tsai, Vice Chairman and CEO of MediaTek, said in response to the shareholders' questions that, in...